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Updated: Jan 14, 2026
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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
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Plasma-Modified Boron Nitride Nanosheets for High-Performance Aramid-Based Dielectric Films with Enhanced
Zi Wang1, Chao Bian1, Jia-Cheng Zhang1
1Clean Energy Power Systems and Equipment Key Laboratory of Sichuan Province, College of Electrical Engineering, Sichuan University, Chengdu, 610065, P. R. China.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|October 24, 2025
Summary
This study enhances aramid paper
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Aramid paper is crucial for electronic insulation but suffers from poor thermal conductivity.
- Existing methods struggle to improve thermal conductivity without compromising other properties.
- Enhanced thermal management is vital for high-power electronic devices.
Purpose of the Study:
- To develop a novel method for improving the thermal conductivity of aramid paper.
- To create a multifunctional dielectric material for advanced electronic applications.
- To investigate the impact of interfacial engineering on material properties.
Main Methods:
- Plasma-assisted amino functionalization of boron nitride nanosheets.
- Self-assembly of functionalized boron nitride nanosheets with aramid nanofibers and Silk Fibroin.
- Fabrication of biomimetic nacre-inspired composite films.
Main Results:
- Achieved a thermal conductivity of 13.89 Wm⁻¹K⁻¹.
- Demonstrated excellent tensile strength (307.08 MPa) and thermal resistance.
- Obtained ultrahigh breakdown strength (430 kVmm⁻¹) and low dielectric loss.
Conclusions:
- The developed composite films offer superior thermal and electrical insulation properties.
- The biomimetic design strategy effectively enhances interfacial interactions and material performance.
- This approach provides a pathway for next-generation polymer-based dielectric materials.
