Effect of Grain Size on Polycrystalline Copper Finish Quality of Ultra-Precision Cutting

Polycrystalline copper optics are widely utilized in infrared systems due to their exceptional electrical and thermal conductivity combined with favorable machining characteristics. The grain size profoundly influences both surface quality consistency and fundamental material removal behavior during processing. This investigation employs multiscale numerical modeling to simulate nanoscale cutting processes in polycrystalline copper with controlled grain structures, coupled with experimental ultra-precision machining validation. Comprehensive analysis of stress distribution, subsurface damage formation, and cutting force evolution reveals that refined grain structures promote more homogeneous plastic deformation, resulting in superior surface finish with reduced roughness and diminished grain boundary step formation. However, the enhanced grain boundary density in fine-grained specimens necessitates increased cutting energy input. These findings establish critical process-structure-property relationships essential for advancing precision manufacturing of copper-based optical systems.