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Thermal Side-Channel Threats in Densely Integrated Microarchitectures: A Comprehensive Review for Cyber-Physical

Amrou Zyad Benelhaouare1, Idir Mellal1, Michel Saydé1

  • 1Department of Engineering and Computer Science, University of Quebec in Outaouais, Gatineau, QC J9A 1L8, Canada.

Micromachines
|October 29, 2025
PubMed

Keywords:
3D-ICsCPSOTRAIISiPTSCAsadvanced microelectronicschiplet-based designcybersecuritydensely integrated microarchitecturesthermal leakage

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