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Sintering for High Power Optoelectronic Devices.

Hannes Schwan1, Nihesh Mohan1, Maximilian Schmid1

  • 1Institute for Innovative Mobility (IIMo), University of Applied Science Ingolstadt, Esplanade 10, 85049 Ingolstadt, Germany.

Micromachines
|October 29, 2025
PubMed
Summary
This summary is machine-generated.

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New copper ink sintering offers a cost-effective alternative to gold-tin solder for optoelectronic devices. While matching silver interconnects, its first-level thermal performance approaches gold-tin, showing promise for advanced electronic packaging.

Area of Science:

  • Materials Science
  • Electrical Engineering
  • Optoelectronics

Background:

  • Eutectic gold-80tin-20 (AuSn) solder is the standard for optoelectronic assembly due to its reliability.
  • High cost of gold necessitates exploring alternative materials for advanced electronic packaging.
  • Copper-based sintering presents a potential low-cost, high-performance interconnect solution.

Purpose of the Study:

  • Investigate the thermal performance of novel copper-based sintering for optoelectronic submodules.
  • Compare particle-free copper ink interconnects with commercial copper, silver nanoparticle interconnects, and AuSn solder.
  • Evaluate the feasibility of copper sintering for both first-level and second-level interconnects.

Main Methods:

  • Utilized a particle-free copper ink based on complexed copper salt, enabling in-situ nanoparticle generation.
Keywords:
copper sinteringoptoelectronicstransient thermal analysis

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  • Sintered interconnects at 275 °C for 15 min under nitrogen with 30 MPa pressure.
  • Performed transient thermal analysis to evaluate thermal performance and shear testing for mechanical strength.

    • Main Results:

    • Achieved uniform 2-5 µm copper layers with shear strengths exceeding 31 MPa.
    • Copper ink interfaces demonstrated thermal performance comparable to thin AuSn joints and matched silver interconnects at second-level.
    • First-level bonding showed AuSn and commercial pastes superior due to copper layer thickness variations.

    Conclusions:

    • Copper-based sintering, particularly with the novel particle-free ink, is a viable, cost-effective alternative to AuSn solder for optoelectronics.
    • Optimization of copper layer uniformity and bonding pressure is crucial for enhancing first-level interconnect performance.
    • This technology holds significant potential for thermally efficient and affordable optoelectronic device assembly.