Recent Advances in Precision Diamond Wheel Dicing Technology

Precision dicing with diamond wheels is a key technology in semiconductor dicing, integrated circuit manufacturing, aerospace, and other fields, owing to its high precision, high efficiency, and broad material applicability. As a critical processing stage, a comprehensive analysis of dicing technologies is essential for improving the machining quality of hard-and-brittle optoelectronic materials. This paper reviews the core principles of precision diamond wheel dicing, including dicing processes and blade preparation methods. Specifically, it examines the dicing mechanisms of composite and multi-mode dicing processes, demonstrating their efficacy in reducing defects inherent to single-mode approaches. The review also examines diverse preparation methods for dicing blades, such as metal binder sintering and roll forming. Furthermore, the roles of machine vision and servo control systems are detailed, illustrating how advanced algorithms facilitate precise feature recognition and scribe line control. A systematic analysis of key components in grinding wheel dicer is also conducted to reduce dicing deviation. Additionally, the review introduces models for tool wear detection and discusses material removal mechanisms. The influence of critical process parameters-such as spindle speed, feed rate, and dicing depth-on dicing quality and kerf width is also analyzed. Finally, the paper outlines future prospects and provides recommendations for advancing key technologies in precision dicing, offering a valuable reference for subsequent research.