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Related Experiment Video

Updated: Jan 6, 2026

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

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Published on: June 23, 2017

Electromagnetic interference shielding using metal and MXene thin films.

Geosan Kang¹, Guhyeon Kwon¹, Jiwoon Jeon²

¹Department of Materials Science and Engineering, Seoul National University, Seoul, Republic of Korea.

|October 30, 2025

Summary

This summary is machine-generated.

Researchers developed a novel thin-film electromagnetic interference (EMI) shielding using embedded MXene within metal films. This breakthrough offers superior shielding performance for small electronic devices without traditional limitations.

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Area of Science:

Materials Science
Nanotechnology
Electrical Engineering

Background:

Traditional bulky metal cans for electromagnetic interference (EMI) shielding are being replaced by thin films for small-form-factor devices.
Reducing shield thickness often compromises performance due to material skin depth limitations.
Existing porous shielding materials face challenges with thinness, uniformity, and processing.

Purpose of the Study:

To develop a novel thin-film shielding solution for electromagnetic interference (EMI).
To overcome the performance limitations of current thin-film shielding technologies.
To enable conformal EMI protection for ubiquitous electronics.

Main Methods:

Embedding non-porous MXene films within metal thin films.
Fabricating simple-stacked metal/MXene/metal structures.
Characterizing shielding performance and analyzing underlying physical mechanisms.

Main Results:

Achieved unprecedented EMI shielding performance at a thickness of just 1 μm (70 decibels).
Demonstrated shielding of 80 decibels at 1.9 μm thickness, deviating from typical thickness dependency.
Identified electromagnetic wave confinement and polarization loss at metal-MXene interfaces as key mechanisms.

Conclusions:

Embedded-MXene-in-metal shields offer superior EMI protection compared to porous alternatives.
This technology enables conformal EMI shielding for portable electronics like USB flash drives and flexible diodes.
The findings pave the way for advanced packaging technologies and EMI-free ubiquitous electronics.