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Dynamically autofocused 3D pulsed laser micromachining enables advanced 3D bioelectronics.

Massimo Mariello1, Joseph G Troughton1,2, Yixuan Leng1

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Dynamically autofocused 3D pulsed laser micromachining (d-3DPLM) offers a rapid, cost-effective method for fabricating advanced bioelectronic interfaces. This technique enables complex 3D structures for seamless integration with biological tissues.

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Area of Science:

  • Bioelectronic Interfaces
  • Advanced Manufacturing
  • Materials Science

Background:

  • Next-generation bioelectronic devices require soft, miniaturized designs for seamless tissue integration.
  • Conventional UV photolithography faces limitations due to hazardous chemicals, labor intensity, and planar construction.
  • Existing methods struggle to produce complex, three-dimensional (3D) bioelectronic architectures.

Purpose of the Study:

  • To introduce a novel fabrication technique for advanced bioelectronic interfaces.
  • To overcome the limitations of current UV photolithography methods.
  • To enable the cost-effective and rapid production of complex 3D bioelectronic devices.

Main Methods:

  • Utilized dynamically autofocused 3D pulsed laser micromachining (d-3DPLM) with a nanosecond pulsed near-infrared laser.
  • Enabled rapid, cost-effective structuring of diverse materials including thin films, metal foils, and bulk metal.
  • Supported monolithic, multilayer bioelectronics with complex 3D architectures.

Main Results:

  • Achieved high-resolution ablation and patterning for conformable and functional device geometries.
  • Demonstrated fabrication of microneedles and deployable elements for bioelectronic systems.
  • Successfully created electro-haptic patches, in vitro multielectrode diagnostic arrays, and wireless contact lenses.

Conclusions:

  • d-3DPLM provides a versatile method for broadening the design and manufacturing landscape of bioelectronic systems.
  • This technique facilitates improved performance, unique functionality, and enhanced integration with living tissue.
  • Paves the way for next-generation bioelectronic devices with complex 3D architectures.