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Fabrication and Testing of Photonic Thermometers
Published on: October 24, 2018
Flexible testbed for prototyping photonic processors
Abstract:
The demand for neuromorphic photonic systems is hindered by the high development costs and inflexibility of traditional photonic integrated circuits (PICs) once fabricated. This work introduces a reconfigurable testbed for prototyping photonic processors, featuring modular, hot-swappable components and standardized connectivity. The system uses fiber-coupled architecture with MEMS-based variable optical attenuators (VOAs) for rapid weight adjustments, balanced photodetectors for signal integration, and wavelength-division multiplexing (WDM) for parallel processing. Calibration ensures 5.85 bits of precision, enabling high-fidelity operations. Experimental validation shows the testbed's versatility, achieving low root mean square error (RMSE) in finite impulse response (FIR) filtering and 2D image convolutions, and 75% accuracy on ImageNet subsets (comparable to digital) when integrated into a ResNet-18 model. The platform's scalability and cost-effectiveness make it a useful addition to accelerating photonic processor design and short-term deployments of real-time signal processing and AI inferencing.

