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Machine Learning Inversion of Layer-Wise Plasticity and Interfacial Cohesive Parameters in Multilayer Thin Films
Baorui Liu1, Shuyue Liu2, Kaiwei Xing2
1Science and Technology on Reliability and Environment Engineering Laboratory, Beijing Institute of Structure and Environment Engineering, Beijing 100076, China.
This study introduces a machine learning method for rapid material parameter evaluation in multilayer thin films. It significantly improves efficiency and accuracy for plastic parameters and interfacial properties compared to traditional techniques.
Area of Science:
- Materials Science
- Computational Materials Science
- Machine Learning Applications
Background:
- Traditional material parameter inversion for thin films is time-consuming and inefficient.
- Multilayer thin-film structures require accurate characterization of layer-wise properties and interfaces.
Purpose of the Study:
- To develop a fast and efficient machine learning-based method for evaluating material parameters in multilayer thin films.
- To overcome the limitations of traditional parameter inversion techniques.
Main Methods:
- Conducting nanoindentation experiments to gather data for multilayer thin films.
- Building a 2D elasto-plastic model to generate load-depth curves for machine learning training.
- Training and validating a machine learning model using simulated and experimental data.
Main Results:
- The machine learning model accurately identifies layer-wise plastic parameters and interfacial cohesive properties.
- Achieved high accuracy in inverting interlayer cohesion parameters with a correlation coefficient R² ≥ 0.99.
- Reduced parameter estimation time to under 1 hour for batch analysis, significantly improving efficiency.
Conclusions:
- The proposed method offers a highly accurate and efficient alternative for material parameter evaluation in multilayer thin films.
- This approach provides a valuable tool for performance evaluation and optimization design of thin-film materials.
- The method demonstrates broad applicability and potential for advancing thin-film material characterization.
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