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Multimaterial 3D Printing of Soft and Stretchable Electronics.

Omid Dadras-Toussi1, Bhoomija Hariprasad1, Mohammad Reza Abidian1

  • 1Department of Biomedical Engineering, University of Houston, 3517 Cullen Blvd, Houston, TX, 77204, USA.

Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|November 21, 2025
PubMed
Summary

Researchers developed a new 3D printable resin for soft electronics. This advanced material offers high conductivity and stretchability for flexible devices and biointerfaces.

Keywords:
additive manufacturingcarbon nanotubesmicroelectronicsmultimaterial 3D printingtwo‐photon polymerization conducting polymers

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Microelectronics Engineering

Background:

  • Soft and stretchable microelectronics are crucial for advanced flexible devices and biointerfaces.
  • Existing 3D printing methods like two-photon polymerization (2PP) struggle with low conductivity, filler clumping, and reduced transparency.

Purpose of the Study:

  • To develop a novel multimaterial resin compatible with 2PP for high-performance soft microelectronics.
  • To overcome the limitations of current 3D printing techniques in creating conductive and transparent soft materials.

Main Methods:

  • Integration of PEDOT:PSS and multi-walled carbon nanotubes into a PEGDA hydrogel matrix.
  • Optimization of the composite resin for 2PP compatibility, achieving high resolution and optical transparency.
  • Fabrication and testing of microelectronic components like microresistors and microcapacitors.

Main Results:

  • Achieved electrical conductivity of 1.4 × 10⁵ S m⁻¹, a 10⁴-fold improvement over pristine PEGDA.
  • Maintained over 80% optical transmittance and stable high-resolution patterning.
  • Demonstrated specific capacitance of ≈667 F g⁻¹ in printed microcapacitors.
  • Exhibited robust mechanical properties, retaining ≈65% conductivity under 50% strain and stability after 3000 stretching cycles.
  • Confirmed chemical stability across a pH range of 3-10.

Conclusions:

  • The developed multimaterial resin enables monolithic integration of conductive, insulating, and electroactive components for soft microelectronics.
  • This approach advances scalable fabrication of flexible, stretchable, and chemically stable biointerfaces, wearable devices, and microscale energy storage systems.
  • The optimized composite overcomes key limitations of 2PP for advanced soft electronic applications.