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Area of Science:

  • Acousto-optics
  • Spintronics
  • Quantum Technology
  • Surface Acoustic Waves (SAW)

Background:

  • Precise phonon manipulation is crucial for advanced fields like quantum technology.
  • Surface acoustic waves (SAW) on piezoelectric substrates offer a promising platform for phonon control.
  • Phonon emission, alongside propagation, is a key design consideration.

Purpose of the Study:

  • To develop a novel heterogeneous substrate for enhanced phonon manipulation.
  • To realize unidirectional emission of different phonon modes using symmetric transducers.
  • To propose and demonstrate a minimal on-chip frequency splitter based on the new platform.

Main Methods:

  • Fabrication of a heterogeneous substrate using ion slicing technology, bonding 42°Y cut LiTaO3 thin film on 4H-SiC.
  • Utilizing a double-modes natural unidirectional transducer (DMNUDT) design.
  • Characterization of unidirectional phonon emission and frequency splitting capabilities.

Main Results:

  • Successful fabrication of the LiTaO3/4H-SiC heterogeneous substrate.
  • Realization of unidirectional emission of shear horizontal SAW and longitudinal leaky SAW phonons in opposite directions using symmetric transducers.
  • Demonstration of a minimal on-chip piezoelectric frequency splitter with >15 dB transmission ratio within a resonator footprint.

Conclusions:

  • The developed DMNUDT on the heterogeneous substrate enables unprecedented control over phonon emission directionality.
  • The novel platform facilitates the creation of compact and efficient on-chip signal processing devices like frequency splitters.