Related Experiment Video
Updated: Jan 10, 2026

The Frequency Domain Thermoreflectance Technique for Thermal Property Measurements
Published on: December 5, 2025
Efficient thermal management of electronic devices by constructing interlayer phonon bridges
Gaojie Han1, Hongli Cheng1, Yuezhan Feng2
1State Key Laboratory of Structural Analysis, Optimization and CAE Software for Industrial Equipment, National Engineering Research Center for Advanced Polymer Processing Technology, Zhengzhou University, Zhengzhou, China.
Abstract:
Layered film-based thermal management materials with high in-plane thermal conductivity can effectively diffuse point heat sources and prevent local overheating. However, their low through-plane thermal conductivity limits its overall heat dissipation. Here, we introduce a honeycomb-gel densification strategy that forms zigzag yet continuous interlayer phonon bridges within the layered structure. This design establishes bi-directional thermal pathways, boosting both in-plane and through-plane thermal conductivity by 488.9% and 503.3% of the aramid nanofiber/boron nitride nanosheet, respectively, compared to random-gel densified films. Also, the aramid nanofiber/boron nitride nanosheet film exhibits high solar reflectivity, infrared emissivity, and thermal radiation, enabling efficient subambient cooling (17.2 °C at 100 mW/cm²) for heat-generating devices.
Related Concept Videos
Mechanism of heat transfer
Mechanisms of Heat Transfer II
Mechanisms of Heat Transfer
Conduction, accounting for approximately 3% of body heat loss at rest, is the process of exchanging heat between molecules of two materials in direct contact. This can result in both heat loss and gain. For instance, when the body is submerged in water, which conducts heat 20 times more effectively than air, it can either lose or gain significant...
Thermal expansion and Thermal stress: Problem Solving
To solve the problem, first, identify the known and unknown quantities. The initial length (L) of the bridge is 1275 m, the coefficient of linear expansion (α) for steel is 12 x 10-6/°C, and the change in temperature (ΔT) is 55...
Mechanisms of Heat Transfer I
Semiconductors
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...

