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Evaluation of a Silicon Carbide Static Induction Transistor for High Frequency/High Temperature Sensor Interface
Jonathon R Grgat1, Maximilian C Scardelletti2, Christian A Zorman1
1Department of Electrical, Computer, and Systems Engineering, Case Western Reserve University, Cleveland, OH 44106, USA.
This study characterizes silicon carbide static induction transistors (SiC SITs) for high-temperature, high-frequency sensor circuits. A validated small-signal model demonstrates excellent agreement with measurements up to 400 °C.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Physics
Background:
- Silicon carbide (SiC) devices offer superior performance in harsh environments.
- Existing characterization of SiC Static Induction Transistors (SITs) is limited to lower temperatures.
- Sensor interface circuits require robust components capable of high-frequency and high-temperature operation.
Purpose of the Study:
- To characterize SiC SITs for sensor interface circuits operating up to 100 MHz and 400 °C.
- To develop and validate a high-temperature small-signal model for SiC SITs.
- To establish a foundation for advanced high-temperature, high-frequency electronic circuit development.
Main Methods:
- Experimental measurements of current-voltage characteristics and capacitive parameters from 25 °C to 400 °C.
- Extrapolation of transconductance (gm) and development of a small-signal model.
- Comparison of simulated scattering parameters against measured data using circuit simulation tools.
Main Results:
- Strong agreement between measured and simulated scattering parameters (<0.1 dB difference at 400 °C, 20-100 MHz).
- Average transition frequency (ft) of 197.8 MHz from measurements, closely matching the simulated 200 MHz.
- Successful characterization of SiC SITs at temperatures exceeding 100 °C, a first in published literature.
Conclusions:
- The developed high-temperature SiC SIT model accurately predicts device behavior up to 400 °C.
- SiC SITs are suitable for high-frequency sensor interface circuits operating in extreme temperature conditions.
- This work enables further innovation in high-temperature semiconductor electronics.
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