Related Experiment Video
Updated: Jan 10, 2026

09:24
Micropunching Lithography for Generating Micro- and Submicron-patterns on Polymer Substrates
Published on: July 2, 2012
15.6K
Non-loss engraved circuit patterning method of semi-liquid metal for precision recyclable multi-substrate circuits
Xiaoqing Li1,2, Tianyu Li2, Yubing Liu1
1State Key Laboratory of Cryogenic Science and Technology, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, China.
Nature Communications
|November 27, 2025
Summary
This study introduces a novel, cost-effective method for fabricating precise liquid metal circuits using ethanol. This technique enables scalable, sustainable flexible electronics for diverse applications.
Area of Science:
- Materials Science
- Nanotechnology
- Electronics Engineering
Background:
- Room-temperature liquid metal alloys are key for flexible electronics due to their unique properties.
- Conventional patterning methods for liquid metal circuits are costly, complex, and environmentally problematic, hindering scalability.
Purpose of the Study:
- To develop a non-loss, high-precision fabrication method for semi-liquid metal circuits.
- To overcome the limitations of traditional patterning techniques for liquid metal electronics.
Main Methods:
- Utilized ethanol to control interfacial adhesion between liquid metal and substrates.
- Employed a custom-designed displacement apparatus for precise adhesion control.
- Demonstrated patterning across diverse substrates from micro- to centimeter scales.
Main Results:
- Achieved seamless patterning of liquid metal circuits with features down to 5 μm.
- Fabricated circuits exhibited high stretchability (1000% strain), reusability, and recyclability.
- The method proved cost-effective, operationally simple, and compatible with various substrates.
Conclusions:
- The developed technique offers a sustainable and scalable approach for liquid metal electronics manufacturing.
- Demonstrated potential for multifunctional flexible circuits in wearable electronics, aerospace, and smart home devices.
- Paves the way for advanced, environmentally friendly flexible electronic device fabrication.

