Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

Semiconductors01:22

Semiconductors

1.3K
There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
1.3K
Detection of Gross Error: The Q Test01:00

Detection of Gross Error: The Q Test

6.8K
When one or more data points appear far from the rest of the data, there is a need to determine whether they are outliers and whether they should be eliminated from the data set to ensure an accurate representation of the measured value. In many cases, outliers arise from gross errors (or human errors) and do not accurately reflect the underlying phenomenon. In some cases, however, these apparent outliers reflect true phenomenological differences. In these cases, we can use statistical methods...
6.8K
Bonding and Strength of Aggregate01:12

Bonding and Strength of Aggregate

437
The bond between aggregate particles and the cement matrix is significantly influenced by the shape and surface texture of the aggregates. High-strength concretes benefit from a rougher texture, which leads to stronger bonding due to greater adhesion. Angular aggregates with larger surface areas also enhance this bond. The bonding quality, however, is complex to assess as no universally accepted test exists. Good bonding is indicated when a crushed concrete specimen shows some aggregate...
437
Electronic Distance Measuring Instruments01:30

Electronic Distance Measuring Instruments

437
Electronic Distance Measuring Instruments (EDMs) are essential tools in modern surveying, offering precise distance measurements by emitting electromagnetic signals and calculating the time required for these signals to travel to a target and return. Two primary types of signals are used in EDMs — light waves and microwaves — each suited to specific environmental and distance requirements. Light-wave-based EDMs utilize either infrared or laser light, providing high accuracy over...
437
High-Performance Liquid Chromatography: Types of Detectors01:15

High-Performance Liquid Chromatography: Types of Detectors

1.5K
The role of the detectors in High-Performance Liquid Chromatography (HPLC) is to analyze the solutes as they exit from the chromatographic column. The detector recognizes the solute's property and generates corresponding electrical signals, which are converted into a readable graph of the detector's response versus elution time called a chromatogram at the computer. There are several types of HPLC detectors, each with its own advantages and limitations, depending on the analyte...
1.5K

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Artifact-Free Dark-Field Scattering Microspectroscopy for Single-Particle Chiral Measurements at the Nanoscale.

ACS nano·2026
Same author

Promoting plasmonic photocatalysis with ligand-induced charge separation under interband excitation.

Chemical science·2023
Same author

Comparison of three-dimensional motion of bacteria with and without wall accumulation.

Physical review. E·2023
Same author

Synthesis and Multipole Plasmon Resonances of Spherical Aluminum Nanoparticles.

The journal of physical chemistry letters·2020
Same author

Polarized evanescent waves reveal trochoidal dichroism.

Proceedings of the National Academy of Sciences of the United States of America·2020
Same author

Acoustic Vibrations of Al Nanocrystals: Size, Shape, and Crystallinity Revealed by Single-Particle Transient Extinction Spectroscopy.

The journal of physical chemistry. A·2020
Same journal

RETRACTED: Zhang et al. A Novel Framework for Reconstruction and Imaging of Target Scattering Centers via Wide-Angle Incidence in Radar Networks. <i>Sensors</i> 2025, <i>25</i>, 6802.

Sensors (Basel, Switzerland)·2026
Same journal

Enhancing Unsupervised Multi-Source Domain Adaptation for Person Re-Identification via Mixture of Experts and Graph-Based Relation.

Sensors (Basel, Switzerland)·2026
Same journal

Development of an Instrumented Glove for Palmar Pressure Assessment in Kayakers.

Sensors (Basel, Switzerland)·2026
Same journal

Development and Experimental Validation of an Autonomous IoT-Based Monitoring System for Real-Time Water Quality Assessment in the Amazon River.

Sensors (Basel, Switzerland)·2026
Same journal

Semi-Supervised Adversarial Learning Framework for Controller Area Network Bus Intrusion Detection.

Sensors (Basel, Switzerland)·2026
Same journal

Smart Optimization Method for Safety Signs in Innovative Manufacturing Environments Integrating Industrial Field IoT Sensors and Knowledge Graphs.

Sensors (Basel, Switzerland)·2026
See all related articles

Related Experiment Video

Updated: Jan 9, 2026

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers
04:36

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers

Published on: September 1, 2023

3.9K

High-Speed Die Bond Quality Detection Using Lightweight Architecture DSGβSI-SECS-Yolov7-Tiny.

Bao Rong Chang1, Hsiu-Fen Tsai2, Wei-Shun Chang1

  • 1Department of Computer Science and Information Engineering, National University of Kaohsiung, Kaohsiung 81148, Taiwan.

Sensors (Basel, Switzerland)
|December 11, 2025
PubMed
Summary
This summary is machine-generated.

A new intelligent vision inspection model, DSGβSI-SECS-YOLOv7-tiny, enhances die bond quality detection for high-speed IC packaging. This advanced model improves accuracy and speed, reducing manufacturing costs.

Keywords:
DSGβSI-SECS-Yolov7-tinyECA netSE layercoordinate attentiondepthwise separable convolutionghost convolutionsmall object enhancer

More Related Videos

Fully Automated Centrifugal Microfluidic Device for Ultrasensitive Protein Detection from Whole Blood
08:58

Fully Automated Centrifugal Microfluidic Device for Ultrasensitive Protein Detection from Whole Blood

Published on: April 16, 2016

11.0K
Fabrication of Carbon Nanotube High-Frequency Nanoelectronic Biosensor for Sensing in High Ionic Strength Solutions
12:20

Fabrication of Carbon Nanotube High-Frequency Nanoelectronic Biosensor for Sensing in High Ionic Strength Solutions

Published on: July 22, 2013

18.7K

Related Experiment Videos

Last Updated: Jan 9, 2026

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers
04:36

Author Spotlight: Real-Time Imaging of Bonding in 3D-Printed Layers

Published on: September 1, 2023

3.9K
Fully Automated Centrifugal Microfluidic Device for Ultrasensitive Protein Detection from Whole Blood
08:58

Fully Automated Centrifugal Microfluidic Device for Ultrasensitive Protein Detection from Whole Blood

Published on: April 16, 2016

11.0K
Fabrication of Carbon Nanotube High-Frequency Nanoelectronic Biosensor for Sensing in High Ionic Strength Solutions
12:20

Fabrication of Carbon Nanotube High-Frequency Nanoelectronic Biosensor for Sensing in High Ionic Strength Solutions

Published on: July 22, 2013

18.7K

Area of Science:

  • Semiconductor Manufacturing
  • Artificial Intelligence in Quality Control
  • Computer Vision for Industrial Inspection

Background:

  • Die bonding is crucial for IC packaging quality and yield.
  • Increased automation speeds necessitate faster, more accurate visual inspection.
  • Existing inspection methods struggle with high-speed production lines, leading to misclassifications.

Purpose of the Study:

  • To develop a high-speed intelligent vision inspection model for die bonding.
  • To improve classification accuracy and adapt to next-generation automated machinery.
  • To enable real-time process parameter adjustments for enhanced yield and reduced costs.

Main Methods:

  • Developed DSGβSI-SECS-YOLOv7-tiny, an enhanced lightweight model.
  • Integrated depthwise separable convolution, Ghost convolution, and a learnable Sigmoid activation.
  • Incorporated SE layer, ECA-Net, Coordinate Attention, and Small Object Enhancer for improved performance.

Main Results:

  • Achieved an inference speed of 294.1 FPS.
  • Reached a precision rate of 99.1%.
  • Demonstrated superior performance compared to the previous DSGβSI-YOLOv7-tiny model.

Conclusions:

  • The DSGβSI-SECS-YOLOv7-tiny model offers a significant advancement in high-speed die bonding quality inspection.
  • The model's efficiency and accuracy support real-time defect detection and process optimization.
  • This technology promises to improve IC packaging yield and reduce manufacturing losses.