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Laser-Engineered Interfacial Dielectrophoresis-Aligned Nanowire Networks for Transparent Electromagnetic
Jungang Zhang1, Venkatarao Selamneni2, Bhavani Prasad Yalagala1
1Microelectronics Laboratory (meLAB), James Watt School of Engineering, University of Glasgow, Glasgow G12 8QQ, U.K.
ACS Nano
|December 16, 2025
Summary
We developed a new method using interfacial dielectrophoresis (i-DEP) and laser treatment to precisely align and enhance nanowires (NWs) on flexible films. This improves electrical properties and electromagnetic interference shielding for advanced electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Nanowires (NWs) are promising for high-performance electronics.
- Integrating NWs onto flexible substrates is challenging due to lack of control and alignment strategies.
- Current methods face limitations in manufacturing reliability, efficiency, and scalability.
Purpose of the Study:
- To propose a scalable method for precise NW manipulation and enhancement.
- To improve the integration of NWs onto flexible polymer films.
- To advance the performance of flexible electronic devices.
Main Methods:
- Developed an interfacial dielectrophoresis (i-DEP) method for NW manipulation (translational and rotational).
- Applied noncontact picosecond laser post-treatment for NW junction welding.
- Fabricated ultrathin silver nanowire (AgNW)/polyimide films.
Main Results:
- Achieved precise NW alignment (0-150° rotation) on polymer films.
- Reduced sheet resistance by ~46x and enhanced transmittance by 10% via laser welding.
- Demonstrated 35 dB electromagnetic interference (EMI) shielding effectiveness, a >1000x improvement over random networks.
- Showcased enhanced shielding from capacitively coupled interwire networks in aligned structures.
Conclusions:
- The laser-engineered, i-DEP-aligned NW network enhances interfacial quality.
- This provides a systematic strategy for fabricating high-performance flexible transparent electronic devices.
- The method advances wireless electronics by improving NW integration and performance.
Keywords:
electromagnetic interference shieldingflexible and transparent electronic devicesinterfacial-dielectrophoresisnanowiresnoncontact laser post-treatment
