2D TMD-Based Backplane Circuitry for Large-Area Electronics

Large-area electronics enable multifunctional platforms that integrate sensing, actuation, display, and energy-harvesting capabilities over extensive areas. These novel form factors, ultrathin, lightweight, and mechanically flexible or stretchable, are realized through low-temperature, large-area-compatible processes, including printing, solution processing, and vapor deposition. While typically optimized for low-to-mid-range operation, such systems support diverse applications ranging from flexible displays and large-area sensors to thin-film photovoltaics and electronic skin. Nevertheless, significant manufacturing challenges remain, particularly in the integration of rigid components with compliant substrates and the development of application-specific functionalities for emerging technologies. 2D materials have emerged as a versatile solution, offering atomic-scale thickness, exceptional flexibility, and diverse electronic properties. Among them, film-type 2D materials, especially transition-metal dichalcogenides (TMDs) synthesized via chemical vapor deposition, combine high performance with compatibility for large-scale integration. In this article, the role of film-type 2D TMDs is reviewed in backplane circuitry for scalable electronic systems, summarizing past progress, highlighting recent advances, and identifying the remaining challenges to the practical deployment of next-generation large-area electronics.