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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

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Published on: April 13, 2016

A Multi-Parameter Inspection Platform for Transparent Packaging Containers: System Design for Stress, Dimensional,

Huaxing Yu¹, Zhongqing Jia¹, Chen Guan¹

¹Shandong Key Laboratory of Optoelectronic Sensing Technologies, National-Local Joint Engineering Laboratory for Energy and Environment Fiber Smart Sensing Technologies, Laser Institute, Qilu University of Technology (Shandong Academy of Sciences), 3501 Daxue Road, Changqing District, Jinan 250353, China.

Sensors (Basel, Switzerland)

|December 31, 2025

Summary

This study introduces a unified inspection platform for pharmaceutical packaging, integrating stress, dimensional, and defect measurements. The system achieves high accuracy for quality control in packaging production.

Keywords:

coordinated inspection defect detection dimensional measurement machine learning residual stress

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Area of Science:

Materials Science
Optical Engineering
Quality Control

Background:

Increasing quality demands in pharmaceutical and cosmetic packaging necessitate advanced inspection methods.
Existing inspection systems often lack integration, requiring multiple platforms for comprehensive quality assessment.
Transparent ampoules require precise evaluation of internal stress, dimensions, and surface integrity.

Purpose of the Study:

To develop a unified inspection platform for transparent ampoules.
To synergistically integrate residual stress measurement, dimensional assessment, and surface defect detection.
To validate the platform's performance under production-like conditions.

Main Methods:

Non-contact residual stress measurement using the photoelastic method.
Telecentric imaging with subpixel contour extraction for dimensional accuracy.
A YOLOv8-based deep learning model for efficient surface defect identification.

Main Results:

Achieved a stress measurement error of ±3 nm.
Demonstrated dimensional accuracy of ±0.2 mm.
Obtained a mean average precision (mAP@0.5) of 90.3% for defect detection.

Conclusions:

The unified platform meets industrial inspection requirements for pharmaceutical and cosmetic packaging.
The system exhibits strong scalability and engineering potential for future applications.
Future work will focus on real-time operation and intelligent quality prediction through stress-defect coupling.