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Updated: Jan 7, 2026

Optimizing Extracellular Vesicle Delivery Using a Core-Sheath 3D-Bioprinted Scaffold for Chronic Wound Management
Published on: February 28, 2025
Electrically stimulated asymmetric double-layer scaffolds using 3D printing and electrospinning for enhanced
Jieun Lee1,2, Aayushi Randhawa1,2, Hyeonseo Park1,2
1Department of Biosystems Engineering, Kangwon National University, Chuncheon, 24341, Republic of Korea.
Abstract:
Wound healing is a complex process that can be severely impaired in chronic or infected wounds. To overcome these challenges, we developed a bioinspired, double-layer asymmetric hydrogel scaffold combining a conductive hydrogel with an antibacterial electrospun fiber layer. The conductive hydrogel, composed of gelatin, Poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT: PSS), and carboxymethyl chitosan (CMCS), provides electrical conductivity under external electric fields, thereby promoting cell activity, migration, and tissue regeneration. CMCS further contributes antibacterial and hydrating properties, creating a favorable microenvironment for wound repair. The electrospun fiber layer, consisting of polycaprolactone (PCL), polylactic acid (PLA), and curcumin (CUR), provides sustained antibacterial protection by inhibiting bacterial proliferation and forming a protective barrier. In vitro experiments showed that electrical stimulation (ES) enhanced cell migration and alignment via electrotaxis, while the electrospun fiber layer effectively suppressed bacterial growth. These results demonstrate the synergistic effect of the conductive hydrogel and antibacterial electrospun fiber layer. This multifunctional, skin-like dressing addresses limitations in current wound care by integrating electrical stimulation with bioactive materials, accelerating tissue regeneration, and providing long-term antibacterial efficacy. The scaffold design mimics natural skin properties and supports efficient wound healing, highlighting its potential as a platform for regenerative medicine applications.

