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Published on: August 15, 2015
Near-Zero TCF and High Quality Factor Achieved in Li2Ti1-x(Fe1/2Nb1/2)xO3-Based Microwave Dielectric Ceramics via
Zuwei Wang1,2,3,4, Huanhuan Guo1,2,3, Hongbing Wei1,3,4
1National Engineering Research Center for Domestic & Building Ceramics, Jingdezhen Ceramic University, Jingdezhen 333403, China.
Abstract:
Modern wireless communication systems put higher requirements on microwave dielectric ceramics in terms of dielectric properties, temperature stability, and low-temperature sintering process. To address the challenges associated with high-frequency signal attenuation, thermal effects, and the high-density integration of multiple-input multiple-output systems, microwave dielectric materials based on the Li2Ti1-x(Fe1/2Nb1/2)xO3 ceramic system were designed and prepared in this study. A monoclinic (cation-ordered)-cubic (cation-disordered) biphasic composite structure was engineered via (Fe1/2Nb1/2)4+ solid solution-induced phase transition, enabling effective tuning toward a near-zero temperature coefficient of resonance frequency (TCF). When x = 0.05, the composite ion synergistic effect significantly suppresses the oxygen vacancy defects and achieves an optimal Q × f value of 65,320 GHz. Furthermore, different proportions of LiF (in the range of 0-8 wt %) were investigated, and the introduction of 4 wt % LiF effectively reduces the sintering temperature of the ceramic to 925 °C, meeting the requirements of the low-temperature cofired ceramic process. The optimized ceramic exhibits excellent dielectric properties (εr = 22.3, Q × f = 70,300 GHz (at 7.32 GHz), TCF = -6.1 ppm/°C) and strong compatibility with silver electrodes. A prototype microstrip patch antenna designed using this ceramic for the BeiDou B1C band (operating at 1.575 GHz) demonstrated high simulated radiation efficiency (96.1%) and gain (4.0 dBi). This study represents significant advancements in TCF precision tuning and low-temperature sintering, offering innovative material solutions for 5G/6G communication devices.
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