Related Experiment Video
Updated: Jan 13, 2026

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
Published on: August 28, 2018
Wafer-Scale Bandgap-Tunable MoS2/PbS Phototransistors Enabled by Solution Processing
Ziheng Tang1, Chengqian Cui2, Xiaoli Jing3
1Department of Mechanical Engineering, Tsinghua University, Beijing, China.
Abstract:
Molybdenum disulfide (MoS2)/lead sulfide (PbS) heterostructures exhibit exceptional potential because of their strong light-matter interactions and high carrier mobility. Critically, bandgap engineering can further optimize the light-absorption range for next-generation phototransistors. However, the bandgap engineering capability for MoS2/PbS heterojunctions formed by conventional transfer-after-chemical vapor deposition (CVD) fabrication is typically inherently restricted due to solely vertical interlayer coupling. Here, to realize wafer-scale bandgap-tunable MoS2/PbS phototransistors, we investigate the band structure of vertical and lateral MoS2/PbS heterojunctions via ab initio calculations and find that lateral heterojunctions in heterostructures dominate the bandgap tunability via tuning of the Type-II band alignment. To achieve wafer-scale uniformity, we investigated how plasma treatment modulates the thin-film surface energy, and the results substantially improved fabrication scaling of MoS2/PbS heterojunctions from traditional micro-scale level to an incredible 4-inch wafer-scale with near-ideal yields (97%) and enabled bandgap tunability (from 1.24 to 0.61 eV). The resulting phototransistors exhibit a maximum responsivity of 88 A/W, specific detectivity of 4.77 × 1012 Jones, and a typical on/off ratio of 3.16 × 107. This work establishes a pathway for developing wafer-scale bandgap-tunable optoelectronics.
More Related Videos
10:36Electric-field Control of Electronic States in WS2 Nanodevices by Electrolyte Gating
Published on: April 12, 2018
08:50Preparation of Large-area Vertical 2D Crystal Hetero-structures Through the Sulfurization of Transition Metal Films for Device Fabrication
Published on: November 28, 2017