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Author Spotlight: Advancing Energy Solutions Using Nanocomposites as Processed Thermoelectric Materials
Published on: May 17, 2024
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Liquid Metal-Architected Thermal Management Materials: Void Engineering for Simultaneous High Thermal Conductivity
Jeongmin Jo1,2, Yongchan Jang1, Ji-Hun Seo2
1Electronic Convergence Materials & Device Research Center, Korea Electronics Technology Institute, Seongnam-si, Gyeonggi-do, Republic of Korea.
Small (Weinheim an Der Bergstrasse, Germany)
|January 25, 2026
Summary
This study introduces a novel void engineering technique for silicone composites, significantly boosting thermal conductivity and flame retardancy. This method enhances performance for advanced electronics by creating multifunctional fillers and eliminating internal voids.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Thermal management materials require high thermal conductivity and flame retardancy for high-performance electronics.
- Achieving both properties simultaneously presents a significant challenge due to conflicting material requirements.
Purpose of the Study:
- To develop advanced thermal management materials with enhanced thermal conductivity and flame retardancy.
- To address limitations in current materials for high-power electronic applications through innovative void engineering.
Main Methods:
- Liquid metal-architected void engineering in silicone composites using mechanochemical encapsulation.
- Creation of multifunctional aluminum nitride (AlN) core-shell fillers with eutectic gallium-indium (EGaIn).
- Systematic interfacial microstructural control to eliminate processing-induced voids and promote thermal network formation.
Main Results:
- Achieved exceptional in-plane thermal conductivity of 4.60 W m-1 K-1 and out-of-plane of 5.27 W m-1 K-1 at 50 vol.% loading.
- Demonstrated 2.19- to 2.69-fold enhancement in thermal conductivity compared to pristine composites.
- Void elimination correlated with superior thermal transport, mechanical integrity, and enhanced flame retardancy, reducing total heat release by 13.39%.
Conclusions:
- Systematic void engineering via liquid metal-architected core-shell fillers offers a practical solution for high-performance thermal management materials.
- This approach successfully balances high thermal conductivity and flame retardancy, meeting safety and performance demands for advanced electronics.
- The developed materials provide a pathway for next-generation electronic systems requiring superior thermal management and fire safety.
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