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Published on: August 6, 2021
Development of 3D-Printable Lead-Free Composite Materials for Mixed Photon and Neutron Attenuation
Shirin Arslonova1, Jurgita Laurikaitiene1, Diana Adliene1
1Department of Physics, Kaunas University of Technology, Studentu Str. 50, LT51368 Kaunas, Lithuania.
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The growing use of radiation technologies has increased the need for shielding materials that are lightweight, safe, and adaptable to complex geometries. While lead remains highly effective, its toxicity and weight limit its suitability, driving interest in alternative materials. The process of 3D printing enables the rapid fabrication of customized shielding geometries; however, only limited research has focused on 3D-printed polymer composites formulated specifically for mixed photon-neutron fields. In this study, we developed a series of 3D-printable ABS-based composites incorporating tungsten (W), bismuth oxide (Bi2O3), gadolinium oxide (Gd2O3), and boron nitride (BN). Composite filaments were produced using a controlled extrusion process, and all materials were 3D printed under identical conditions to enable consistent comparison across formulations. Photon attenuation at 120 kVp and neutron attenuation using a broad-spectrum Pu-Be source (activity 4.5 × 107 n/s), providing a mixed neutron field with a central flux of ~7 × 104 n·cm-2·s-1 (predominantly thermal with epithermal and fast components), were evaluated for both individual composite samples and layered (sandwich) configurations. Among single-material prints, the 30 wt% Bi2O3 composite achieved a mass attenuation coefficient of 2.30 cm2/g, approximately 68% of that of lead. Layered structures combining high-Z and neutron-absorbing fillers further improved performance, achieving up to ~95% attenuation of diagnostic X-rays and ~40% attenuation of neutrons. The developed materials provided a promising balance between 3D-printability and dual-field shielding effectiveness, highlighting their potential as lightweight, lead-free shielding components for diverse applications.
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