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Related Concept Videos

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Electron carriers can be thought of as electron shuttles. These compounds can easily accept electrons (i.e., be reduced) or lose them (i.e., be oxidized). They play an essential role in energy production because cellular respiration is contingent on the flow of electrons.
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Updated: Feb 4, 2026

Procedure for the Transfer of Polymer Films Onto Porous Substrates with Minimized Defects
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Direct Printing of Electronics on Flexible Porous Substrates.

Bheema Sankar Reddy1, Chandantaru Dey Modak1, Deepak Sharma1

  • 1Centre for Nanoscience and Engineering (CeNSE), Indian Institute of Science, Bangalore, Karnataka, India.

Small (Weinheim an Der Bergstrasse, Germany)
|February 2, 2026
PubMed
Summary

Drop Impact Printing (DIP) enables high-concentration ink deposition on porous substrates for flexible electronics. This nozzle-free method enhances device performance and durability, paving the way for advanced wearable sensors and energy storage solutions.

Keywords:
drop impactelectronicsflexibleporousprinting

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Area of Science:

  • Materials Science
  • Flexible Electronics
  • Nanotechnology

Background:

  • Porous substrates like paper and fabric are crucial for flexible electronics due to their unique properties.
  • Challenges in fabricating flexible electronics on porous substrates include ink spreading and solvent penetration.
  • Existing methods struggle with large-scale, high-performance fabrication on untreated porous materials.

Purpose of the Study:

  • To introduce Drop Impact Printing (DIP) as a novel nozzle-free technique for depositing concentrated inks onto porous substrates.
  • To demonstrate DIP's capability to overcome fabrication challenges and enhance the properties of flexible electronic devices.
  • To showcase the application of DIP in creating high-performance microsupercapacitors and humidity sensors.

Main Methods:

  • Utilized Drop Impact Printing (DIP) for precise microdroplet ejection onto untreated porous substrates.
  • Employed highly concentrated inks (up to 70% mass loading) to improve particle retention and conductivity.
  • Investigated the sieve-impact mechanism to reduce lateral ink spread and substrate swelling.

Main Results:

  • DIP significantly reduced ink spread and penetration, preserving substrate properties.
  • Microsupercapacitors fabricated with 70% mass loading showed a 41-fold increase in areal capacitance at high scan rates.
  • Humidity sensors exhibited a ~60% increase in response with higher ink concentrations (10% to 55%).
  • Demonstrated integrated, self-powered, and wireless humidity-sensing systems fabricated entirely via DIP.

Conclusions:

  • Drop Impact Printing is a viable and effective method for fabricating high-performance flexible electronics on porous substrates.
  • DIP enhances device conductivity, mechanical durability, and sensing capabilities.
  • The developed technology shows significant potential for real-world applications in wearable health monitors and environmental sensing.