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Published on: September 11, 2018
High Thermoelectric Performance Achieved in Nb0.8Ti0.2FeSb via PbI2-Driven Multiscale Defect Engineering
Panpan Peng1, Zhihao Li1, Jianhong Hu1
1School of Physics, State Key Laboratory of Crystal Materials, Shandong University, Jinan, P. R. China.
This study introduces a novel method using sublimable compounds to create hierarchical structures in NbFeSb half-Heusler alloys. This significantly reduces thermal conductivity while enhancing mechanical and thermoelectric performance.
Area of Science:
- Materials Science
- Solid State Physics
- Thermoelectrics
Background:
- NbFeSb-based half-Heusler alloys possess good electrical and mechanical properties but are limited by high lattice thermal conductivity.
- Reducing thermal conductivity in these alloys is challenging due to high-temperature processing requirements for complex microstructures.
Purpose of the Study:
- To develop a method for creating hierarchical microstructures in NbFeSb alloys to reduce thermal conductivity.
- To investigate the impact of these microstructures on thermoelectric and mechanical properties.
Main Methods:
- Incorporation of PbI2 during ball-milling of Nb0.8Ti0.2FeSb.
- Sublimation of PbI2 during high-temperature sintering to form hierarchical structures.
- Characterization of microstructures, thermal conductivity, electrical conductivity, power factor, and mechanical properties.
Main Results:
- Hierarchical structures including PbI2 nanophases, core-shell pore@Pb structures, multiscale porosity, and Fe vacancies were formed.
- Lattice thermal conductivity was reduced by 32% to 3.34 W m-1 K-1 at 973 K due to full-spectrum phonon scattering and lattice softening.
- Power factor reached 52.7 µW cm-1 K-2 (zT ~ 1) with improved electrical conductivity.
- Compressive strength increased by 38% to 1132 MPa, and microhardness reached 950 HV.
Conclusions:
- Sublimable compounds effectively create hierarchical architectures in high-temperature thermoelectrics.
- This approach simultaneously enhances thermoelectric efficiency and mechanical robustness.
- The developed method offers a pathway for advanced thermoelectric materials.
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