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Updated: Feb 15, 2026

Preparation of Mica and Silicon Substrates for DNA Origami Analysis and Experimentation
Published on: July 23, 2015
Morad Mirzajanzadeh1, Damiano Pasini2
1Department of Mechanical Engineering, McGill University, Montreal, QC, Canada.
Researchers developed a novel origami crease pattern for doubly curved surfaces, overcoming limitations in load-bearing capacity and stiffness. This breakthrough enables the creation of deployable, shape-changing metamaterials with tunable rigidity.
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