Search research articles

ABOUT JoVE

Overview Leadership Blog JoVE Help Center

AUTHORS

Publishing Process Editorial Board Scope & Policies Peer Review FAQ Submit

LIBRARIANS

Testimonials Subscriptions Access Resources Library Advisory Board FAQ

RESEARCH

JoVE Journal Methods Collections JoVE Encyclopedia of Experiments Archive

EDUCATION

JoVE Core JoVE Business JoVE Science Education JoVE Lab Manual Faculty Resource Center Faculty Site

Terms & Conditions of Use

Related Concept Videos

Thermal Stress

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by

Same author

Progress of iron-based magnetic nanomaterials: synthesis, properties, and emerging applications.

Nanotechnology·2026

Same author

Phonons regulate covalency: a new way to modulate the magnetism and Curie temperature of CrI<sub>3</sub>.

Physical chemistry chemical physics : PCCP·2026

Same author

MXene/biomacromolecule composites: structures, properties, fabrication and applications.

Nanoscale·2026

Same author

Staggering thermal transport in 2H-TiS<sub>2</sub> dominated by acoustic-like optical phonons.

Nanoscale·2026

Same author

A Comprehensive Model for Spinodal Decomposition in Ag-Cu Alloys Based on Phase-Field Theory and In Situ TEM.

ACS applied materials & interfaces·2025

Same author

Theoretical prediction of stress-tunable optoelectronic properties of GaSeI: a novel 1D helical van der Waals crystal.

Nanoscale·2025

Search research articles

Related Experiment Video

Updated: Feb 18, 2026

Author Spotlight: Optimization of Airflow Velocities in Battery Cooling Systems for Enhanced Thermal Performance and Reduced Energy Consumption

Author Spotlight: Optimization of Airflow Velocities in Battery Cooling Systems for Enhanced Thermal Performance and Reduced Energy Consumption

Published on: November 3, 2023

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Yongjun Huo^1,2, Jiaqi Song¹, Wenqian Li¹

¹School of Materials Science and Engineering, Beijing Institute of Technology, Beijing, China.

Advanced Science (Weinheim, Baden-Wurttemberg, Germany)

|February 16, 2026

Summary

This summary is machine-generated.

Advanced thermal management materials are crucial for miniaturized, high-power electronics. This review covers ceramic substrates and thermal interface materials (TIMs), highlighting AI/ML for optimizing heat transfer and reliability in next-gen packaging.

Keywords:

ceramic substrate multiscale simulation power electronics thermal interface materials thermal management materials

More Related Videos

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

Published on: July 5, 2024

Asymmetric Thermoelectrochemical Cell for Harvesting Low-grade Heat under Isothermal Operation

Asymmetric Thermoelectrochemical Cell for Harvesting Low-grade Heat under Isothermal Operation

Published on: February 5, 2020

Related Experiment Videos

Last Updated: Feb 18, 2026

Author Spotlight: Optimization of Airflow Velocities in Battery Cooling Systems for Enhanced Thermal Performance and Reduced Energy Consumption

Author Spotlight: Optimization of Airflow Velocities in Battery Cooling Systems for Enhanced Thermal Performance and Reduced Energy Consumption

Published on: November 3, 2023

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

Author Spotlight: Simulation and Analysis of the Temperature Rise of Ring Main Unit Equipment

Published on: July 5, 2024

Asymmetric Thermoelectrochemical Cell for Harvesting Low-grade Heat under Isothermal Operation

Asymmetric Thermoelectrochemical Cell for Harvesting Low-grade Heat under Isothermal Operation

Published on: February 5, 2020

Area of Science:

Materials Science
Thermal Engineering
Electrical Engineering

Background:

Miniaturization and high power density in electronics demand advanced thermal management.
Packaging materials face challenges in heat dissipation from device to sink.
Substrates and thermal interface materials (TIMs) are key for heat flow.

Purpose of the Study:

To summarize recent advances in thermal management materials for power electronics.
To focus on ceramic substrates (Si3N4) and various TIM systems.
To review simulation and AI/ML tools for materials optimization.

Main Methods:

Review of ceramic-based substrate systems, particularly Si3N4.
Analysis of TIM systems: conductive adhesives, diamond composites, 2D filler composites.
Exploration of multiscale simulations and AI/ML for interfacial heat transport.

Main Results:

Improvements in thermal conductivity and reduced thermal resistance achieved.
Enhanced mechanical reliability through process optimization and interfacial engineering.
Hybrid filler designs and advanced materials show significant promise.

Conclusions:

Next-generation power electronics require scalable, reliable, and intelligent thermal management.
Materials innovation, process optimization, and AI/ML are vital for future solutions.
Guidance provided for academic research and industrial deployment.