Yongjun Huo
5PUBLICATIONS
4CO-AUTHORS
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Publications (5)
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|Feb 16, 2026
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.Yongjun Huo, Jiaqi Song, Wenqian Li
|Sep 12, 2025
A Comprehensive Model for Spinodal Decomposition in Ag-Cu Alloys Based on Phase-Field Theory and In Situ TEM.Xin Chen, Lin Yang, Yuan Zhang
|Apr 02, 2025
Molecular Dynamics Analysis of the Solid-State Bonding Mechanism and High Strain Rate Response for (1 1 1)-Oriented Nanotwinned Silver.Sichen Liu, Shuang Zhao, Donglin Zhang
|Apr 13, 2024
Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.Yexing Fang, Taiyu Wang, Yue Gu
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