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Yongjun Huo

5PUBLICATIONS

4CO-AUTHORS

Power electronicsTransition metal chemistryNanofabrication, growth and self assemblyPolymers and plasticsDigital electronic devices

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Publications (5)

Sort by Publication Date:

|Feb 16, 2026

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Yongjun Huo, Jiaqi Song, Wenqian Li

|Sep 12, 2025

A Comprehensive Model for Spinodal Decomposition in Ag-Cu Alloys Based on Phase-Field Theory and In Situ TEM.

Xin Chen, Lin Yang, Yuan Zhang

|Apr 02, 2025

Molecular Dynamics Analysis of the Solid-State Bonding Mechanism and High Strain Rate Response for (1 1 1)-Oriented Nanotwinned Silver.

Sichen Liu, Shuang Zhao, Donglin Zhang

|Apr 13, 2024

Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.

Yexing Fang, Taiyu Wang, Yue Gu

|Mar 29, 2023

Advanced Electronic Packaging Technology: From Hard to Soft.

Yue Gu, Yongjun Huo

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Frequent Collaborators

2 joint publications

Yue Gu

2 joint publications

Xiuchen Zhao

2 joint publications

Gang Zhang

1 joint publications

Lin Yang

Frequent Collaborators

2 joint publications

Yue Gu

2 joint publications

Xiuchen Zhao

2 joint publications

Gang Zhang

1 joint publications

Lin Yang

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