Related Experiment Video

Updated: Jun 10, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.5K

Advanced Electronic Packaging Technology: From Hard to Soft

Yue Gu1,2, Yongjun Huo1

  • 1School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.

Materials (Basel, Switzerland)
|March 29, 2023
PubMed

Abstract:

Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...].

More Related Videos

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.5K
Author Spotlight: Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing
05:57

Author Spotlight: Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing

Published on: March 17, 2023

2.3K

Related Experiment Videos

Last Updated: Jun 10, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
07:51

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

7.5K
Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.5K
Author Spotlight: Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing
05:57

Author Spotlight: Microfluidic Channel-Based Soft Electrodes and Their Application in Capacitive Pressure Sensing

Published on: March 17, 2023

2.3K

Related Concept Videos

Semiconductors01:22

Semiconductors

There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...

Articles linked to this work by shared authors, journal, and citation graph.

Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics.

Advanced science (Weinheim, Baden-Wurttemberg, Germany)·2026

Rapid Multianalyte Quantification of Brain Chemistry Using Si-Nanoribbon Bio-Field-Effect Transistor Sensors.

ACS applied materials & interfaces·2025

A Comprehensive Model for Spinodal Decomposition in Ag-Cu Alloys Based on Phase-Field Theory and In Situ TEM.

ACS applied materials & interfaces·2025

Molecular Dynamics Analysis of the Solid-State Bonding Mechanism and High Strain Rate Response for (1 1 1)-Oriented Nanotwinned Silver.

ACS applied materials & interfaces·2025

Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.

Materials (Basel, Switzerland)·2024

Stretchable ultrasonic arrays for the three-dimensional mapping of the modulus of deep tissue.

Nature biomedical engineering·2023

Correction: Ahmed, I.A.; S. Al-Radadi, N. Estimating the Impact of Nanophases on the Production of Green Cement with High Performance Properties. Materials 2020, 13, 4197.

Materials (Basel, Switzerland)·2026

Comparative Thermal Performance of Ultra-High-Performance Concrete and Geopolymer Concrete: Influence of Steel Fibre Geometry on Residual Mechanical and Chemical Properties.

Materials (Basel, Switzerland)·2026

Microstructural Evolution of the NC-UHPC Near-Interface Composite Region Under Sequential Carbonation and Seawater Exposure.

Materials (Basel, Switzerland)·2026

Patient-Clustered Analysis of Recorded Insertion Torque in 101 MultiNeO Titanium Dental Implant Placements: An Exploratory Retrospective Cohort Study.

Materials (Basel, Switzerland)·2026

Amazonian Bioactives in Biopolymer-Based Systems for Biomedical Applications: Current Advances and Future Perspectives.

Materials (Basel, Switzerland)·2026

Internal Degradation of 2.5D C/SiC Composites Under Continuous-Wave Laser Irradiation: Experiments and Phase-Selective Modelling.

Materials (Basel, Switzerland)·2026

Timing of Digital Device Exposure as a Source of Measurement Error in Dry Eye Disease Research: A Critical Narrative Review.

Cureus·2026

High-throughput recovery of integron cassettes for gene discovery screens.

Nature microbiology·2026

Digital twins in precision pharmacotherapy: emerging applications, challenges, and future directions.

Frontiers in digital health·2026

Impact of Continuous Glucose Monitoring for American Indian/Alaska Native Adults With Type 2 Diabetes Mellitus Not Using Insulin.

Federal practitioner : for the health care professionals of the VA, DoD, and PHS·2026

The Influence of Spatial Location and Object Shape on Learning and Re-Learning Spatial Tasks in Dopamine Transporter-Deficient Rats.

Biology·2026

Digital twins in sports science: applications for performance enhancement, injury prevention, and rehabilitation through advanced big data analytics and deep learning methodologies - a comprehensive narrative review.

Biology of sport·2026
See all related articles
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies
Jove
Visualize
Contact Us