Related Experiment Video
Updated: Jun 10, 2026

07:51
High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
7.5K
Advanced Electronic Packaging Technology: From Hard to Soft
Yue Gu1,2, Yongjun Huo1
1School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.
Materials (Basel, Switzerland)
|March 29, 2023
Abstract:
Packaging is a pivotal step in electronic device manufacturing, determining the translational performance of bare chips [...].

