Advanced Electronic Packaging Technology: From Hard to Soft

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Updated: Jun 10, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
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High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

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Yue Gu1,2, Yongjun Huo1

  • 1School of Materials Science and Engineering, Beijing Institute of Technology, Beijing 100081, China.

Materials (Basel, Switzerland)
|March 29, 2023
PubMed

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There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
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