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Updated: Jun 24, 2026
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Microfluidic Fabrication of Polymeric and Biohybrid Fibers with Predesigned Size and Shape
Published on: January 8, 2014
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Spinning, Functionalizing, and Assembling of Flexible Fiber Electronics and Their Applications
Zifeng Wang1, Yunyao Tang1, Yu Wang1
1School of Health Science and Engineering, University of Shanghai for Science and Technology, Shanghai, China.
Small (Weinheim an Der Bergstrasse, Germany)
|February 18, 2026
Summary
This review explores advancements in fiber electronics, focusing on spinning, functionalization, and assembly techniques for flexible electronics and wearable devices. It highlights materials and applications, offering insights into future research directions.
Area of Science:
- Materials Science
- Electrical Engineering
- Textile Engineering
Background:
- Fibers are crucial in flexible electronics, wearable technologies, and soft robotics due to their flexibility and tunable properties.
- Fibers serve as versatile platforms for active materials, conductive interconnects, and miniaturized components in advanced applications.
Purpose of the Study:
- To review recent progress in fiber spinning, functionalization, and assembly technologies for fiber electronics.
- To provide roadmaps for mastering techniques to create tailored fiber electrodes and devices.
- To discuss materials, applications, challenges, and future opportunities in fiber electronics.
Main Methods:
- Analysis of recent advancements in fiber spinning techniques.
- Review of functionalization strategies for creating fiber devices.
- Examination of assembly methods for fiber-based systems.
Main Results:
- Discussion of key fabrication parameters for controlling material distribution and achieving desired fiber properties.
- Highlighting spinnable and functional materials, with emphasis on structure-property correlations.
- Elaboration on applications in energy storage/conversion and wearable sensors.
Conclusions:
- Fiber electronics fabrication requires mastering spinning, functionalization, and assembly.
- Material selection and understanding structure-property relationships are key for high-performance devices.
- Significant challenges and opportunities exist for future research in this dynamic field.
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