Evaluation of Copper Incorporation into Titanium via Ion Plating Diversified: Morphological, Structural, and...

Surface contamination of titanium-based implants by microorganisms remains a major clinical challenge. In this study, grade 1 titanium substrates were modified by low-energy ion plating diversified (IPD) with copper ions at 3 keV and 7 keV to evaluate their morphological, structural, and preliminary biological behavior. Characterization by SEM, EDS, and XRF confirmed homogeneous copper incorporation, with similar concentrations (∼0.3 wt %) for both energies. SRIM simulations indicated Gaussian implantation profiles with peak concentrations at 4 nm and 6 nm below the surface, respectively. Salt spray testing showed that copper implantation did not impair the corrosion resistance of titanium. However, biological assays using Staphylococcus aureus revealed no inhibitory halos or significant cell death, indicating that copper ions implanted at these energies do not reach the surface or diffuse into the medium. These findings define the physical limitations of low-energy IPD for antimicrobial surface design, providing helpful guidance for future process optimization.