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Copper damascene process-based high-performance thin-film lithium tantalate modulators.

Mengxin Lin^1,2, Zihan Li^1,2, Alexander Kotz³

¹Institute of Physics, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne, Switzerland.

Nature Communications

|February 26, 2026

Summary

This summary is machine-generated.

Researchers developed a scalable fabrication method for thin-film lithium tantalate modulators using the copper Damascene process. This integration enhances compatibility with microelectronics, improving performance for optical communication systems.

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Area of Science:

Photonics and Materials Science
Integrated Optics
Semiconductor Fabrication

Background:

Electrical-to-optical signal conversion is crucial for optical communications, demanding co-integration with electronics.
Thin-film lithium tantalate (TFLN) is a promising electro-optic platform but faces integration challenges with microelectronic processes.

Purpose of the Study:

To develop an electronics-compatible fabrication approach for TFLN modulators.
To improve the performance and scalability of TFLN-based electro-optic devices.

Main Methods:

Incorporation of the copper Damascene process into TFLN modulator fabrication.
Characterization of microwave loss, optical power handling, and voltage stability.
High-speed data transmission experiments using PAM4 and PAM8 modulation.

Main Results:

The copper Damascene process enables scalable, electronics-compatible TFLN modulator fabrication.
Devices show ~10% lower microwave loss compared to gold-electrode designs.
Watt-level optical power handling and stable quasi-static half-wave voltage (1 Hz–1 MHz) were achieved.
Demonstrated high-speed transmission rates of 416 Gbit/s (PAM4) and 540 Gbit/s (PAM8).

Conclusions:

The copper Damascene process offers a practical route for scalable integration of TFLN electro-optic modulators with microelectronics.
This advancement facilitates chip-on-wafer integration for next-generation optical communication systems.