Multi-Objective Optimization and Performance Evaluation of Rhombic Pin-Fin Microchannel Heat Sinks with Diverse

Ruicheng Rong1, Xiangqi Liu2, Xiao Jin1

  • 1School of Mechanical Engineering, Hangzhou Dianzi University, Hangzhou 310018, China.

Micromachines
|February 27, 2026
PubMed
Summary

Researchers developed novel manifold microchannel heat sinks (MMC) with rhombic pin-fins to address electronic device heat dissipation. A trapezoidal manifold design significantly improved thermal performance and temperature uniformity compared to conventional designs.

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