Multi-Objective Optimization and Performance Evaluation of Rhombic Pin-Fin Microchannel Heat Sinks with Diverse...

In response to the increasingly severe heat dissipation challenges in electronic devices, three types of manifold microchannel heat sinks (MMC) incorporating rhombic pin-fins were proposed. Under the constraint that the maximum temperature of the heat source surface remains below 343.15 K, numerical comparisons with a conventional straight rectangular microchannel heat sinks (MCHS) reveal that the design featuring a trapezoidal manifold exhibits superior comprehensive thermal performance and improved temperature uniformity. Furthermore, the influence of rhombic pin-fin geometry on thermal performance was investigated for both MCHS with and without the trapezoidal manifold under varying mass flow rates. Results show that for the MCHS without a manifold, performance evaluation criterion (PEC) reaches its maximum when the inlet angle of the rhombic pin-fin is 120°, the side length is 0.17 mm, and the pin-fin height is 0.18 mm. In contrast, for the MCHS with the trapezoidal manifold, optimal PEC is achieved at an inlet angle of 110°, a side length of 0.18 mm, and a pin-fin height of 2.2 mm. Additionally, a multi-objective optimization was conducted using the Latin hypercube sampling method. Three objective functions-maximum temperature (Tmax), thermal performance (PEC), and temperature uniformity (σT)-were considered. A total of 150 sample points were used to train Kriging surrogate models for the rhombic pin-fin MCHS with trapezoidal manifold. The optimization results demonstrate a 34.05% enhancement in thermal performance and an 18.6% improvement in temperature uniformity.