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Updated: Jul 12, 2026

The Effect of Anodization Parameters on the Aluminum Oxide Dielectric Layer of Thin-Film Transistors
Published on: May 24, 2020
Threshold-Voltage Modulation and N2O Plasma Passivation for Enhanced Retention and Memory Window in Capacitorless
Chahwan Yang1,2, Mirinae Lee1,2, Junghoon Han1,3
1Flexible Electronic Device Research Division, Electronics and Telecommunications Research Institute, Daejeon, Republic of Korea.
None:
Capacitorless two-transistor-zero-capacitor (2T0C) dynamic random-access memories (DRAMs) offer scalability, simplified processing, and design flexibility by eliminating storage capacitors. We propose 2T0C DRAMs using aluminum-doped indium tin zinc oxide (Al:ITZO) thin-film transistors (TFTs) that enhance both retention time and memory window through device-level engineering. To suppress off-state leakage, N2O plasma treatment was applied, which enabled fine-tuning the threshold voltage (Vth) control via oxygen vacancy reduction, as confirmed by XPS analysis. Additionally, by adjusting the channel width-to-length (W/L) ratio of the read transistor (RTR), three key objectives were achieved. First, the write transistor (WTR) Vth was also engineered to enable hold-state operation at 0 V write word line (WWL), enabling ultra-low-power operation. Second, optimization of the RTR W/L ratio effectively suppressed charge loss, resulting in significantly improved retention characteristics. Third, the memory window was maximized by balancing the intrinsic trade-off between the RTR Vth and on-current (I on). As a result, we achieved retention times exceeding 1000 s and a ∼13-fold increase in memory window. These results demonstrate the feasibility of Al:ITZO-based 2T0C DRAMs for next-generation memory systems with improved scalability and energy efficiency.
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