Surface Buckling-Enabled Fabrication of Metallic Nanomeshes for Lightweight EMI Shielding
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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
Soumyasuravi Thakur1, Arijit Chakraborty1, Nirat Ray1
1Department of Materials Science and Engineering, Indian Institute of Technology (IIT) Delhi, Hauz Khas, New Delhi 110016, India.
Abstract:
Lightweight metallic nanomeshes are promising for electromagnetic interference (EMI) shielding, but scalable, low-cost fabrication routes that yield tunable porosity and optical transparency remain limited. Here, we introduce a polymer surface buckling assisted exfoliation strategy to produce ultrathin 2D metallic meshes of Ni, Ti, and Al with controllable porosity. This approach enables large-area, low-cost fabrication without complex lithography, etching or harsh chemicals, offering a significant advance over conventional preparation routes. The resulting porous metallic networks exhibit absorption-dominated EMI shielding, achieving up to 28 dB shielding effectiveness in the X-band for Ni meshes, with high gains in shielding efficiency per nm. At the highest porosities studied, the metallic meshes show transmittance between 60% and 80% at 400 nm, underscoring their potential for transparent shielding applications. Temperature-dependent electrical measurements on Al and Ni meshes show resistance minima at low temperature, consistent with intergranular/interflake Coulomb interaction effects. Our results demonstrate a scalable fabrication strategy and clarify the structure-property relationships governing charge transport, optical transmittance, and EMI attenuation in metallic nanomeshes.

