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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
Surface Buckling-Enabled Fabrication of Metallic Nanomeshes for Lightweight EMI Shielding
Soumyasuravi Thakur1, Arijit Chakraborty1, Nirat Ray1
1Department of Materials Science and Engineering, Indian Institute of Technology (IIT) Delhi, Hauz Khas, New Delhi 110016, India.
Abstract:
Lightweight metallic nanomeshes are promising for electromagnetic interference (EMI) shielding, but scalable, low-cost fabrication routes that yield tunable porosity and optical transparency remain limited. Here, we introduce a polymer surface buckling assisted exfoliation strategy to produce ultrathin 2D metallic meshes of Ni, Ti, and Al with controllable porosity. This approach enables large-area, low-cost fabrication without complex lithography, etching or harsh chemicals, offering a significant advance over conventional preparation routes. The resulting porous metallic networks exhibit absorption-dominated EMI shielding, achieving up to 28 dB shielding effectiveness in the X-band for Ni meshes, with high gains in shielding efficiency per nm. At the highest porosities studied, the metallic meshes show transmittance between 60% and 80% at 400 nm, underscoring their potential for transparent shielding applications. Temperature-dependent electrical measurements on Al and Ni meshes show resistance minima at low temperature, consistent with intergranular/interflake Coulomb interaction effects. Our results demonstrate a scalable fabrication strategy and clarify the structure-property relationships governing charge transport, optical transmittance, and EMI attenuation in metallic nanomeshes.

