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Study on Interfacial Crack of Piezoelectric Bimaterials Under Dynamic Loading
Yani Zhang1, Junlin Li1, Xiangyu Li2
1School of Applied Science, Taiyuan University of Science and Technology, Taiyuan 030024, China.
This study analyzes dynamic crack propagation in piezoelectric bimaterials, finding crack length and time impact fracture behavior. A random forest model accurately predicts stress intensity factors for engineering applications.
Area of Science:
- Solid Mechanics
- Materials Science
- Fracture Mechanics
Background:
- Engineering applications require understanding material strength and dynamic fracture.
- Piezoelectric bimaterials exhibit complex behaviors under dynamic loading.
- Interface cracks in anisotropic materials present unique challenges.
Purpose of the Study:
- Analyze dynamic crack propagation in orthogonal anisotropic interface cracks within piezoelectric bimaterials.
- Determine stress and electric displacement intensity factors at the crack tip.
- Predict fracture behavior using advanced modeling techniques.
Main Methods:
- Laplace and Fourier transformations to convert governing equations into singular integral equations.
- Chebyshev point method and Laplace inversion to solve for intensity factors.
- Response surface method and random forest modeling for prediction and analysis.
Main Results:
- Crack length positively correlates with the dimensionless function, indicating longer cracks increase stress.
- Smaller elastic parameters generally lead to smaller dimensionless dynamic stress intensity factors.
- Impact time influences dynamic crack propagation, with the dimensionless function peaking and then converging to a static value.
Conclusions:
- The study provides insights into the dynamic fracture mechanics of piezoelectric bimaterials.
- Optimal parameter values were identified for maximizing stress intensity.
- The random forest model demonstrates high predictive accuracy (R²=0.9886) for engineering applications.
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