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Updated: Mar 19, 2026

Bridging the Bio-Electronic Interface with Biofabrication
Published on: June 6, 2012
An Immunocompatible Conductive Hydrogel Via Anion-π Interlocking as an Injectable Bridge for Sustained Bioelectronic
Zihao Zhu1, Yutong Li1, Yukun Wang1
1MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang University, Hangzhou, Zhejiang Province, P. R. China.
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Advances in implantable bioelectronics have improved the interaction between intelligent systems and biological tissues. Yet, the mechanical-immunological mismatch between rigid electrodes and soft tissues continues to limit long-term device stability. Here, we present SSPH, an immunocompatible, injectable, conductive hydrogel bridge that enables minimally invasive delivery and stable tissue integration. By forming a compliant interfacial bridge, SSPH reduces mechanical-biological mismatch and immune stress on electrodes. It is formed by the spontaneous co-assembly of PEDOT:PSS and the zwitterionic polymer poly(sulfobetaine methacrylate) (PSBMA), resulting in a 3D network stabilized by anion-π interactions, electrostatic interactions, and PEDOT-rich nanostructures. This self-healable architecture allows SSPH to maintain its intrinsic conductive pathways after deformation. Experiments confirmed that SSPH exhibits stable electrochemical properties and favorable immunocompatibility. In an acute muscle injury model, SSPH restored signal transmission across the damaged region, demonstrating its potential to serve as a bridge across disrupted tissue. Furthermore, in both electromyography recording and spinal cord stimulation models, SSPH preserved electrode performance for up to four weeks, supporting reliable bidirectional signal conduction. These results highlight SSPH as a promising, durable, and immunocompatible bridging material for sustained bioelectronic interfaces.

