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Printable Liquid Metal-Textiles for Deformation-Insensitive and Electromagnetically Robust mmWave Devices
Lu Ju1,2,3, Buyun Yu2,3, Rui Wang4
1School of Information and Intelligent Science, Donghua University, Shanghai, China.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|March 19, 2026
Summary
Researchers developed new electronic textiles (E-textiles) using liquid metal inks. These durable, flexible millimeter-wave (mmWave) devices maintain performance under bending, enabling robust wireless communication for wearables.
Area of Science:
- Materials Science
- Electrical Engineering
- Wearable Technology
Background:
- Millimeter-wave (mmWave) technologies are crucial for high-data-rate wireless body area networks.
- Mechanical instability and conductive degradation in traditional mmWave devices under deformation pose significant challenges.
- Existing solutions often lack the required robustness for wearable applications.
Purpose of the Study:
- To develop deformation-insensitive, high-performance mmWave electronic textiles (E-textiles).
- To create a scalable and resilient platform for future wearable mmWave devices.
- To overcome the limitations of current materials in high-frequency wearable electronics.
Main Methods:
- Fabrication of E-textiles using specially engineered liquid metal (LM) inks.
- Utilizing a high-resolution "dual-mask" printing technique.
- Formulation of LM inks with polyvinylpyrrolidone (PVP)-stabilized gallium-based nanodroplets for enhanced conductivity and self-healing properties.
Main Results:
- Demonstrated a 26 GHz LM-textile antenna array with 9.65 dBi gain after repeated bending.
- Developed a microstrip transmission line with negligible attenuation increase after mechanical cycling.
- Achieved a wireless transmission range of 4.5 meters for high-definition images, outperforming silver inks and metallic-cloth antennas.
Conclusions:
- Liquid metal electronic textiles offer a promising solution for robust, high-performance wearable mmWave devices.
- The developed LM inks provide excellent surface compatibility, self-healing, and high conductivity for durable circuits.
- This technology enables scalable, flexible, and resilient high-frequency wireless communication for future applications.

