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Advancing the understanding of tablet capping and lamination: a systematical review
Zhaohua Li1, Genyang Ye1, Qun Wang1
1Wuya College of Innovation, Shenyang Pharmaceutical University, No. 103, Wenhua Road, Shenyang 110016, China.
None:
Capping and lamination pose significant risks to both tablet integrity and therapeutic performance. A comprehensive understanding of these defects is therefore critical for ensuring robust tablet production. This review begins by examining the underlying causes and key influencing factors of capping and lamination. It then highlights advanced research methodologies for assessing and predicting defect propensities, with particular emphasis on artificial intelligence technologies. Practical mitigation strategies are also discussed, including material modifications, compaction process optimization, and punch-die tooling design. Furthermore, the review underscores the potential of emerging materials (e.g., nanomaterials and biopolymers) and cutting-edge technologies (e.g., process analytical techniques and artificial intelligence) to support efficient quality control and proactive prediction of tablet failures. Overall, this review aims to provide insights and strategies that guide the design and reliable commercial manufacture of high-quality pharmaceutical tablets.
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