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Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
Published on: May 2, 2016
Yi Mao1, Jiahao Lu1, Junkang Chen1
1MOE Key Laboratory of Macromolecular Synthesis and Functionalization, Department of Polymer Science and Engineering, Zhejiang Key Laboratory of Advanced Organic Materials and Technologies, Research Center for Advanced Fibers, Zhejiang University, 38 Zheda Road, Hangzhou 310027, China.
A novel Janus-structured thermal interface material (TIM) enhances heat dissipation in electronics. This material maintains stable thermal performance under vibration and thermal shock, improving device reliability.
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