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Updated: Jun 8, 2026

Fabrication of Flexible Image Sensor Based on Lateral NIPIN Phototransistors
Published on: June 23, 2018
Two-dimensional materials for integrated sensing
Hangyu Xu1,2, Zhihao Xu3, Qinqi Ren4
1State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai, China.
Abstract:
Recent advances in electrical multiply-accumulate (MAC) operations leveraging resistive-switching materials have catalysed significant progress in optoelectronic sensing and computing technologies through the exploration of emerging materials. These innovative approaches facilitate the encoding of optical amplitude information such as retina-like functionalities. However, a critical dimensional mismatch persists between electrical and optical information, resulting in a substantial portion of high-dimensional data channels remaining unexplored in conventional MAC operation schemes. Combined with advanced device architectures and data algorithms, two-dimensional materials are considered promising candidates to realize in situ encoding and optoelectronic sensing of multi-dimensional optical information under precise control owing to their tunable physical properties. In this Review, we outline the progress of emerging two-dimensional-materials-based 'integrated sensors', and benchmark electrical inputs with optical scenarios in a framework unifying information encoding. Exciting opportunities for integrated sensors are discussed as well, highlighting the requirements and differences in the encoding of different dimensions of information and exploring the potential for integrated sensors in other fields.

