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Accumulation and Analysis of Cuprous Ions in a Copper Sulfate Plating Solution
Published on: March 20, 2019
Complexation Mechanism of a Novel Alkaline Cu(I) Electroplating System Investigated by UV-Visible Spectroscopy
Lixin Yu1, Yuqing Feng1, Zhao-Yun Wang1
1State Key Laboratory of Physical Chemistry of Solid Surfaces; Engineering Research Center of Electrochemical Technologies of Ministry of Education; Department of Mechanical and Electrical Engineering, Pen-Tung Sah Institute of Micro-Nano Science and Technology; Department of Chemistry, College of Chemistry and Chemical Engineering, Xiamen University, Xiamen 361005, China.
Abstract:
Copper (Cu) electroplating has been rising once again due to the giant industrial demands for metal interconnectors in the integrated circuit and the current collector in the lithium-ion battery. If the current acidic Cu(II) electroplating were replaced by the alkaline Cu(I) electroplating, it would reduce electricity consumption by at least 50%, not to mention the environmental friendliness. The bottleneck for alkaline electroplating is the complexation to stabilize the Cu(I) cations in solution. To this end, we developed a novel alkaline Cu(I) electroplating system and studied the complexation mechanism by both ex situ and in situ UV-visible spectroscopy. The results demonstrated that succinimide (SM) is a stronger complexant than sulfite and forms a stable [Cu(SM)2]- ion, which was further stabilized by maltose. The sulfite acted as no longer a complexant but a reductant. Thus, a high-quality Cu-plating layer was obtained with excellent metallographic structure and mechanical performance. The work demonstrates the vital capability of UV-visible spectroscopy in investigations on the action mechanisms of electroplating additives.
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