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Advancing EUV Patterning: Innovations in Resist Platforms, Patterning Strategies, and Computational Approaches.

Madan Rajendra Biradar¹, Gokhan Sagdic¹, Chenyun Yuan¹

¹Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853, United States.

Chemical Reviews

|April 14, 2026

Summary

This summary is machine-generated.

This review traces the evolution of photoresist materials for microelectronics, focusing on challenges and solutions in extreme ultraviolet (EUV) lithography. It highlights advanced resist designs and computational approaches for future patterning strategies.

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Area of Science:

Materials Science
Chemical Engineering
Microelectronics Engineering

Background:

Microelectronics advancements rely on shrinking feature sizes through lithography and patterning materials.
Photoresist technology has evolved through various wavelengths, from 365 nm to 193 nm immersion lithography.

Purpose of the Study:

To review the historical development of photoresist materials.
To address the challenges and solutions in 13.5 nm extreme ultraviolet (EUV) lithography.
To survey current state-of-the-art EUV resist materials and emerging patterning techniques.

Main Methods:

Historical review of photoresist evolution.
Analysis of challenges in EUV lithography, including stochastic effects and secondary electron chemistry.
Survey of advanced resist materials (CARs, metal-organic, molecular glass, etc.).
Brief discussion of directed self-assembly and nanoimprint lithography.

Main Results:

EUV lithography presents unique challenges like stochastic effects and secondary electron chemistry.
Various advanced photoresist materials are being developed for EUV, including CARs, metal-organic, and molecular glass resists.
Computational chemistry and data-driven methods are increasingly important in resist design.

Conclusions:

Connecting molecular design with lithographic performance is crucial for future photoresist development.
Advanced patterning strategies beyond traditional lithography are being explored.
Continued innovation in materials and computational approaches will drive microelectronics progress.