Biaxially Oriented High-Thermal-Conductivity Electromagnetic Wave Absorber Based on Interlayer Phonon Bridge...

Area of Science:

• Materials Science
• Nanotechnology
• Electromagnetics

Background:

• High-power electronics require advanced packaging with electromagnetic wave absorption (EMA) and thermal conductivity.
• Current materials struggle to balance efficient EMA with high thermal conductivity.
• Developing bifunctional materials for electronic packaging remains a significant challenge.

Purpose of the Study:

• To create a novel composite material integrating efficient phonon transport and strong electromagnetic absorption for electronic packaging.
• To address the limitations of existing materials in balancing thermal and electromagnetic properties.
• To provide a materials-structural-function strategy for advanced electronic packaging.

Main Methods:

• Inspired by nacre shell, a layered skeleton-densification strategy was employed.
• Biaxially oriented SiC@BN/WPU composite (B-SCBW) was prepared.
• Phonon bridges were embedded to enhance thermal transport.

Main Results:

• The B-SCBW material demonstrated excellent electromagnetic features with minimum reflection loss of -46.29 dB and an effective absorption bandwidth of 5.02 GHz.
• Outstanding through-plane (6.22 W m⁻¹ K⁻¹) and in-plane (9.27 W m⁻¹ K⁻¹) thermal conductivity were achieved.
• A strong correlation between material structure and performance was elucidated.

Conclusions:

• The developed B-SCBW material effectively balances superior electromagnetic and high thermal conductive attributes.
• This work offers a valuable strategy for fabricating electronic packaging materials with integrated electromagnetic protection and thermal management.
• The findings provide insights for designing advanced materials for demanding electronic applications.