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Universal High-Resolution Copper Patterning on Diverse Substrates via Sequential Laser-Induced Transfer and
Yaqiang Ji1, Juexuan Xu1, Weibin Yin1
1School of Mechanical Engineering, Dongguan University of Technology, Dongguan 523808, China.
Micromachines
|May 4, 2026
Summary
This study introduces a novel laser transfer and plating method for creating high-resolution, durable copper patterns on various flexible electronics. The technique ensures robust performance, enabling advanced applications in tactile sensing and energy harvesting.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Fabricating high-resolution, mechanically robust copper patterns is crucial for flexible electronics.
- Existing methods face challenges in achieving desired resolution and durability.
Purpose of the Study:
- To develop a universal metallization strategy for high-resolution copper patterns.
- To enhance the mechanical robustness and electrical properties of copper patterns for flexible electronics.
Main Methods:
- Sequential two-step laser transfer (laser-induced backward transfer and laser-induced forward transfer).
- Electroless copper plating to amplify embedded catalytic copper particles.
- Utilizing laser-induced mechanical interlocking for enhanced adhesion.
Main Results:
- Achieved high-resolution copper patterns with an average minimum linewidth of approximately 20 μm.
- Demonstrated low electrical resistivity (~2.0 × 10^-8 Ω·m) and excellent electromechanical stability after 8000 bending cycles.
- Successfully integrated fabricated electrodes into a triboelectric nanogenerator for tactile sensing and Morse code transmission.
Conclusions:
- The developed strategy offers a versatile and scalable route for manufacturing reliable copper electrodes.
- The method is compatible with diverse substrates including polyimide, wood, fabric, and paper.
- This approach paves the way for next-generation flexible electronic systems requiring robust copper interconnects.
