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Related Experiment Video

Updated: May 5, 2026

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods

Published on: December 23, 2013

Heterogeneous Integration of Microelectronics by Self-Assembly.

Yingkun Ma¹, Karl F Böhringer¹

¹Department of Electrical and Computer Engineering, University of Washington, Seattle, WA 98195, USA.

|May 4, 2026

Summary

This summary is machine-generated.

System performance gains now depend on advanced packaging and heterogeneous integration as traditional scaling limits are reached. This shift drives innovation in assembly technologies for functional diversification, or "More-than-Moore" approaches.

Area of Science:

Materials Science
Electrical Engineering
Semiconductor Manufacturing

Background:

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Planar CMOS scaling is decelerating, impacting traditional performance improvement trajectories.

Heterogeneous integration and advanced packaging are becoming critical for future system performance.

Cost-per-function pressures are shifting towards large-scale assembly processes.