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Extrusion-printed La3-xTe4 legs with interlocking Ni electrode for high-temperature thermoelectric devices
Alexander Pröschel1, Yunjia Zhang2, Ming Chen2
1Department of Materials Science & Engineering, Northwestern University, Evanston, IL, USA. aproschel@u.northwestern.edu.
Nature Communications
|May 5, 2026
Summary
A novel ink printing method enables cost-effective fabrication of complex thermoelectric legs from lanthanum telluride (La3-xTe4). This additive manufacturing approach yields high-performance, robust thermoelectric devices suitable for scalable applications.
Area of Science:
- Materials Science and Engineering
- Solid State Physics
- Additive Manufacturing
Background:
- Thermoelectric materials offer heat-to-electricity conversion but face commercialization hurdles due to expensive, complex traditional synthesis and assembly.
- Lanthanum telluride (La3-xTe4) is a promising thermoelectric material, but its fabrication typically involves labor-intensive methods like hot pressing.
Purpose of the Study:
- To develop a cost-effective and scalable fabrication method for high-performance thermoelectric legs using additive manufacturing.
- To demonstrate the feasibility of creating geometrically complex La3-xTe4 thermoelectric components with robust interfaces.
Main Methods:
- Ink-extrusion printing of pre-alloyed LaTe1.47 powders followed by debinding and high-temperature sintering.
- Fabrication of non-flat interfaces between LaTe1.47 legs and nickel (Ni) electrodes using the printing methodology.
- Measurement of creep properties and simulation of thermomechanical stress at the thermoelectric-metal junction.
Main Results:
- Successfully fabricated LaTe1.47 thermoelectric legs with high relative densities and phase purity.
- Achieved a high figure of merit (zT = 1.49 ± 0.24 at 1250 K), comparable to conventionally synthesized materials.
- Demonstrated successful printing and diffusion bonding of interlocking LaTe1.47/Ni interfaces, minimizing chemical interdiffusion and showing creep's role in stress relaxation.
Conclusions:
- The ink printing/sintering approach offers an economical and scalable alternative for fabricating complex, high-performance thermoelectric devices.
- This additive manufacturing technique addresses key challenges in thermoelectric device fabrication, enabling robust, high-temperature operation.
- Designed interfaces and understanding creep behavior are crucial for mitigating crack propagation and ensuring long-term device reliability.
