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Related Concept Videos

Field Effect Transistor01:29

Field Effect Transistor

Field-effect transistors (FETs) are integral to electronic circuits and distinguished by their three-terminal setup: the gate, drain, and source. These transistors operate as unipolar devices, which utilize either electrons or holes as charge carriers, in contrast to bipolar transistors, which use both types of carriers. The primary function of the FET is to modulate the flow of these carriers from the source to the drain through a channel. The voltage difference between the gate and source...
Biasing of FET01:22

Biasing of FET

Biasing a Junction Field Effect Transistor (JFET) is crucial for setting operational parameters and ensuring efficient functioning in electronic circuits. JFETs are characterized by using a single carrier type in N-channel or P-channel configurations, where the channel is surrounded by PN junctions. These junctions are central to the device's ability to control current flow.
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the gate...
Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
MOSFET: Depletion Mode01:20

MOSFET: Depletion Mode

Depletion-mode MOSFETs represent a unique subset of MOSFET technology, functioning fundamentally differently from their enhancement-mode counterparts. Unlike enhancement MOSFETs, which require a positive gate-source voltage (Vgs) to turn on, depletion-mode MOSFETs are inherently conductive and "normally on" devices.
The primary characteristic of depletion-mode MOSFETs is their ability to conduct current between the drain and source terminals without gate bias. This inherent conductivity arises...
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The semiconductor's...

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Related Experiment Video

Updated: May 14, 2026

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors
10:31

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors

Published on: November 24, 2016

Terahertz Antenna-Coupled Wire-Channel Field-Effect Transistors Based on AlGaN/GaN Heterostructures.

Maxim Moscotin1, Justinas Jorudas1, Pawel Prystawko2

  • 1Terahertz Photonics Laboratory, Center for Physical Sciences and Technology (FTMC), LT-10257 Vilnius, Lithuania.

Sensors (Basel, Switzerland)
|May 13, 2026
PubMed
Summary

We developed a novel terahertz (THz) detector using a modified EdgeFET (m-EdgeFET) on AlGaN/GaN HEMTs. This hybrid design offers enhanced responsivity and reduced gate leakage for efficient THz detection.

Keywords:
AlGaN/GaN HEMTGaN terahertz devicesTeraFETantenna-coupled FETmodified EdgeFETplasma-wave rectificationterahertz detection

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Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy
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Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy

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Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots
15:47

Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots

Published on: November 1, 2013

Related Experiment Videos

Last Updated: May 14, 2026

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors
10:31

Plasma-assisted Molecular Beam Epitaxy of N-polar InAlN-barrier High-electron-mobility Transistors

Published on: November 24, 2016

Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy
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Fabrication of Schottky Diodes on Zn-polar BeMgZnO/ZnO Heterostructure Grown by Plasma-assisted Molecular Beam Epitaxy

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Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots
15:47

Nanofabrication of Gate-defined GaAs/AlGaAs Lateral Quantum Dots

Published on: November 1, 2013

Area of Science:

  • Terahertz (THz) technology
  • Semiconductor device physics
  • High-frequency electronics

Background:

  • Terahertz (THz) radiation detection is crucial for various applications.
  • Existing detectors often face limitations in sensitivity, speed, or operating conditions.
  • Advanced transistor designs are needed to improve THz detection capabilities.

Purpose of the Study:

  • To propose and investigate a novel antenna-coupled wire-channel field-effect transistor-modified EdgeFET (m-EdgeFET) for THz detection.
  • To evaluate the performance of the m-EdgeFET on AlGaN/GaN high-electron-mobility transistor (HEMT) structures.
  • To analyze the device's responsivity, gate leakage current, and operating regimes.

Main Methods:

  • Fabrication of the proposed m-EdgeFET on AlGaN/GaN HEMT structures.
  • Characterization of the device's response to 150 GHz and 300 GHz radiation at room temperature.
  • Analysis of responsivity dependence on channel length and gate voltage.
  • Investigation of device operation in source-drain (SD) and gate coupling (GG) regimes.

Main Results:

  • The m-EdgeFET demonstrated distinct response characteristics under THz radiation.
  • Peak responsivity reached 6.5 V/W at -3 V gate voltage, with significantly lower gate bias required compared to conventional EdgeFET.
  • Gate leakage current was reduced by an order of magnitude (~1 nA) compared to similar FinFETs.
  • The device operated effectively in both SD and GG coupling regimes.

Conclusions:

  • The proposed m-EdgeFET design offers a promising solution for efficient and electrically controlled THz detection.
  • The hybrid architecture combines advantages of FinFET and EdgeFET concepts for superior performance.
  • The device exhibits high responsivity and low leakage current, suitable for fast THz sensing applications.