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Related Concept Videos

Corrosion02:49

Corrosion

The degradation of metals due to natural electrochemical processes is known as corrosion. Rust formation on iron, tarnishing of silver, and the blue-green patina that develops on copper are examples of corrosion. Corrosion involves the oxidation of metals. Sometimes it is protective, such as the oxidation of copper or aluminum, wherein a protective layer of metal oxide or its derivatives forms on the surface, protecting the underlying metal from further oxidation. In other cases, corrosion is...
Corrosion of Reinforcement01:27

Corrosion of Reinforcement

The corrosion of steel reinforcement within concrete is a process influenced by the material's inherent properties and external factors. The high pH level of around 13, provided by calcium hydroxide present in concrete, initially protects the steel reinforcement by promoting the formation of a passive iron oxide layer on its surface.
However, over time and under certain conditions like carbonation, chloride ingress, and cracking this protective state can be compromised. Steel has areas with...
Microbial Corrosion01:24

Microbial Corrosion

Microbiologically Influenced Corrosion (MIC) is a significant form of material degradation caused by the metabolic activities of microorganisms. This phenomenon poses substantial challenges across various industries, including oil and gas, maritime, and water treatment sectors.MIC occurs when microorganisms, such as bacteria, archaea, and fungi, colonize metal surfaces, forming biofilms that alter the local electrochemical environment. These biofilms can lead to the production of corrosive...
Electrodeposition01:08

Electrodeposition

Electrodeposition is a technique used to separate an analyte from interferents by electrochemical processes. Here, the analyte is a metal ion that can be deposited on an electrode immersed in the sample solution. The electrochemical setup consists of an anode and a cathode. When an electric current is applied to the setup, oxidation occurs at the anode. At the cathode, which consists of a large metal surface, metal ions undergo reduction and deposit onto the surface.
Electrodeposition can...
Microbial Leaching01:27

Microbial Leaching

Microbial leaching, also known as bioleaching, is an environmentally favorable method for extracting metals from low-grade ores using specific microorganisms. This biotechnological approach is particularly valuable for mining operations targeting copper, gold, and uranium, where traditional extraction methods may be economically or environmentally impractical.Copper Leaching and Microbial CatalysisIn copper bioleaching, crushed ore is arranged into heaps and irrigated with a dilute sulfuric...

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Related Experiment Video

Updated: May 16, 2026

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

A molecular pathway to corrosion-resistant printable copper.

Jun Zhang1, Qiubo Zhang2,3, Qikun Feng1

  • 1Department of Materials Science and Engineering, University of Maryland, College Park, MD, USA.

Science (New York, N.Y.)
|May 14, 2026
PubMed
Summary

Researchers developed a low-temperature method to create stable, flexible copper for electronics. This new process enhances conductivity and corrosion resistance, overcoming limitations of current copper protection strategies.

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Published on: March 15, 2017

Area of Science:

  • Materials Science
  • Electrochemistry
  • Surface Chemistry

Background:

  • Copper's high electrical and thermal conductivity are vital for electronics and energy systems.
  • Oxidation and corrosion compromise copper's reliability, necessitating complex protection methods.
  • Existing copper protection often requires high temperatures or multiple processing steps.

Purpose of the Study:

  • To develop a low-temperature molecularly reactive strategy for copper precursor conversion.
  • To achieve simultaneous surface passivation and interparticle fusion at <150°C.
  • To create flexible copper with enhanced stability and low resistivity.

Main Methods:

  • Utilizing catechol-based ligands for copper reduction and surface passivation.
  • Employing a molecularly reactive approach for low-temperature processing (<150°C).
  • Characterizing the resulting copper's electrical, thermal, and stability properties.

Main Results:

  • Successful conversion of copper precursors to metallic copper at <150°C.
  • Formation of an ultrathin carbonaceous and copper(I) surface passivation layer.
  • Achieved flexible copper with low resistivity and exceptional stability (>1000 hours in acid, >200 hours in sulfide, >240 hours at 140°C).

Conclusions:

  • The molecularly reactive strategy effectively resolves the trade-off between conductivity, corrosion resistance, and processability.
  • This method enables the production of high-performance, stable copper for next-generation flexible electronics and energy systems.
  • The catechol-based ligand approach offers a scalable and efficient route to advanced copper materials.