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Updated: May 16, 2026

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
A molecular pathway to corrosion-resistant printable copper
Jun Zhang1, Qiubo Zhang2,3, Qikun Feng1
1Department of Materials Science and Engineering, University of Maryland, College Park, MD, USA.
Abstract:
Copper's exceptional electrical and thermal conductivities make it essential for electronics and energy systems. However, oxidation and corrosion limit its long-term reliability, and existing protection strategies often involve high-temperature or multistep processing. We report a molecularly reactive strategy that converts copper precursors to metallic copper at <150°C, while generating an ultrathin carbonaceous and copper(I) surface passivation. Catechol-based ligands mediate copper reduction, enable low-temperature interparticle fusion, and impart surface passivation, yielding flexible copper with low resistivity and exceptional stability (>1000 hours in acid, >200 hours in sulfide, >240 hours at 140°C). This strategy resolves the long-standing trade-off between conductivity, corrosion resistance, and processability for next-generation flexible electronics and energy systems.
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